Abstract
Deposition of bulk copper on thin film gold surfaces is carried out by computer-aided pulse plating. It is demonstrated that the morphology of the copper deposit can be studied by in situ scanning tunnelling microscopy both in potentiostatic experiments and in galvanostatic experiments. Optimized procedures for obtaining smooth deposits by pulse plating are explained in terms of a levelling effect. Possible non-faradaic processes observed in measurements with high frequency pulse plating are discussed.
| Original language | English |
|---|---|
| Pages (from-to) | 151-159 |
| Number of pages | 9 |
| Journal | Surface and Coatings Technology |
| Volume | 67 |
| Issue number | 3 |
| DOIs | |
| Publication status | Published - Oct 1994 |
All Science Journal Classification (ASJC) codes
- General Chemistry
- Condensed Matter Physics
- Materials Chemistry
- Surfaces, Coatings and Films
- Surfaces and Interfaces