Abstract
Advances in thin-film deposition expose new frontiers to structures and phases that are inaccessible by conventional chemical means and have led to innovative modification of existing materials' properties. Thin-film deposition by magnetron sputtering is highly dependent on ion bombardments; coupled with sublimation of solid target unto the substrate through momentum transfer. It is summarily base on phase change of target material under high-energy influence; corresponding controlled condensation of sputtered atoms on substrate material during which process parameters and growth conditions dictate the pace of the atomic scale processes for thin-film formation. Magnetron sputtering is a state-of-the-art thin film deposition technique versatile for several unique applications, especially in the semiconductor industry. Magnetron sputtering is very novel in its use to achieve low-pressure condition that maximizes and conserve stream of electrons for effective knocking of inert atoms into ions. This ensures the highenergy acquired is not dissipated in gas-phase collisions.
| Original language | English |
|---|---|
| Title of host publication | Production, Properties, and Applications of High Temperature Coatings |
| Publisher | IGI Global |
| Pages | 403-428 |
| Number of pages | 26 |
| ISBN (Electronic) | 9781522541950 |
| DOIs | |
| Publication status | Published - 2018 |